So I finally attempted a de-lid of the CELL and RSX on my CECHA01. Process went smoothly and I also implemented the 'eraser trick' as outlined by NakedSnake in order to make the CELL have better contact with the IHS. The PS3 boots fine in the XMB, it feels cold and the fans are running slowly. All this changes when I decided to test it during gameplay. Black Ops 1 was notorious for causing my PS3 to ramp up its fan speed in only 10-15 mins of gameplay. I figured it would be the perfect candidate to test my first ever de-lidded PS3. Unfortunately, by the time you get to the main menu, the PS3 quickly ramps up the fan through all the fan steps, though the console still feels pretty cool by the vents. The only thing I can think of is the RSX, I struggled with removing the adhesive glue from the memory chips. Alternatively, I wasn't sure which application to use for the thermal paste on the CELL/RSX die so I opted to spread the thermal paste across the die. Once the IHS was reattached, I used the small 'pea' method and let the heatsink do its thing to spread the thermal paste. Any suggestions? Was really pleased until I went to test gameplay. To add - the PS3 is on OFW, not CFW. Thanks for the help.