Seriously I've been thinking about this more and more of late. And I'm struggling to understand why Sony used ihs on the rsx and cell. Especially given the context that the previous generations most powerful console(Original xbox) didn't. It had the heatsinks directly to the die. This has been bugging me since it seems like most of the issues the older ps3 deal with are directly related to the tim under the ihs degrading or capacitors failing(which you could make a case that excess retained heat didn't exactly help). Surely it must have been more expensive to use the ihs given it would mean extra machining and an extra application of tim. Further unlike the desktops of the time the ps3 chip height would always be consistent given its mass produced nature. So why was it done that way? An attempt to help protect the chip die in the install or transportation process? I'm just honestly rather confused why the ihs were chosen vs direct contact. Maybe a concern that the heat sink in direct contact would put too much pressure and damage the chip? But then we have the xbone and ps4 where the heat sink is direct to the die. So were they just doing what the pc part makers were doing? I guess the question is there any documentation to why the heck that decision was made? Or what thoughts do the rest of you more experienced folks have.