Dylan w
Member
Okay, I think I have have proven my theory about the silicone spacer between cell base and IHS lid. Also the reason why we have heating issues even after Frankenstein etc etc.
So I am here to seek advice discuss and bounce ideas back and fourth.
I have been using 9 consoles of cok-001 and cok-002 boards for models ceche01 and cecha01 to test my theories.
My board was off .3mm and I put in a spacer of .3mm (between cell IHS lid and the heatsink) and the paste is evenly spread on the die of the cell now and it's more evenly spread on the rsx. But rsx still little off on space so I put .01mm spacer and it has dropped my temps. I got readings from multiple boards. I have proven the theory right.
*to do the work yourself or another tech:
To see how much space you need to add between the IHS and the heatsink you must measure the thickness of the plates for the heatsink and the height from board to IHS lid. Best to do this before delidding and after if you plan to delid which I highly recommend doing.
This will tell you what you need for space to add.
Mine came out to .2-.3mm. And it has fixed all the issues pertaining to thermal transfer rate and uneven spread of the paste on dies and that my heatsink plates are now evenly spreading pressure across the to and the board…
My dies are evenly spreading paste and I have dropped my temps!!
My fan isn't kicking on hardcore anymore and has gotten better with each test and with each new piece of data!
Do not remove silicone spacer unless you plan to replace it with correct thickness of .15-.25mm
Woooooooo!!!!!!
Hell yeah 20 hours well spent on this project!
Make sure to buy caliper and do measurements so you don't mess your console up.
Happy gaming!
So I am here to seek advice discuss and bounce ideas back and fourth.
I have been using 9 consoles of cok-001 and cok-002 boards for models ceche01 and cecha01 to test my theories.
My board was off .3mm and I put in a spacer of .3mm (between cell IHS lid and the heatsink) and the paste is evenly spread on the die of the cell now and it's more evenly spread on the rsx. But rsx still little off on space so I put .01mm spacer and it has dropped my temps. I got readings from multiple boards. I have proven the theory right.
*to do the work yourself or another tech:
To see how much space you need to add between the IHS and the heatsink you must measure the thickness of the plates for the heatsink and the height from board to IHS lid. Best to do this before delidding and after if you plan to delid which I highly recommend doing.
This will tell you what you need for space to add.
Mine came out to .2-.3mm. And it has fixed all the issues pertaining to thermal transfer rate and uneven spread of the paste on dies and that my heatsink plates are now evenly spreading pressure across the to and the board…
My dies are evenly spreading paste and I have dropped my temps!!
My fan isn't kicking on hardcore anymore and has gotten better with each test and with each new piece of data!
Do not remove silicone spacer unless you plan to replace it with correct thickness of .15-.25mm
Woooooooo!!!!!!
Hell yeah 20 hours well spent on this project!
Make sure to buy caliper and do measurements so you don't mess your console up.
Happy gaming!
