CECHA01 Modding for Longevity/Quietness

psy1 said:
The more w/mk the better when talking about thermal conductivity.
The ones you mention are 15w/mk the ones I'm talking about are 62.5 W / mk.
Over 4x better.
These: https://www.thermal-grizzly.com/en/products/299-carbonaut-en
Click to expand...
Those are special made of carbon, i would use it only for the EEGS or the SB of the COK-001 motherboard, but not for CELL/RSX and of course not for any other component

The thermal pads of silicone i was talking about are intended to be placed on top of voltage regulators, the wifi/bt module... or even at the back of the motherboard to transfer the heat from the motherboard fiberglass (around CELL/RSX) to the metal interference shield
 
sandungas said:
but not for CELL/RSX and of course not for any other component
Click to expand...
The Carbonaut according to the company that makes them are made for CPUs and GPUS (CELL & RSX)
The other thermal pads that they sell called "Minus Pad 8" are made for other components such as voltage regulators, wifi etc.
 
psy1 said:
The more w/mk the better when talking about thermal conductivity.
The ones you mention are 15w/mk the ones I'm talking about are 62.5 W / mk.
Over 4x better.
These: https://www.thermal-grizzly.com/en/products/299-carbonaut-en
Click to expand...
That's only partially true.
W/mK is just one of the factors.
62.5W/mK is a lot yes, but that carbon thermal "pad" is very thin. And sure enough, the thinner it is, the better the "potential" thermal conductivity (W/mK)

But that thing is so thin, that it could hardly be called a thermal "pad". Probably it will only be suitable for very narrow gap between 2 smooth surfaces. So not really comparable in my opinion.
More similar to thermal paste I would say, except I doubt it will be as good as paste in filling the natural gaps.
May be good for extremely flat surfaces... but that's on paper after all
 
psy1 said:
The Carbonaut according to the company that makes them are made for CPUs and GPUS (CELL & RSX)
The other thermal pads that they sell called "Minus Pad 8" are made for other components such as voltage regulators, wifi etc.
Click to expand...
We can only share with you the knowledge & experience we have acquired, we know exactly what to expect from silicon pads, we know they are safe & reliable for ps3 usage.
Alternative solutions have been tested but user reports have not been good most of the time. So it's all up to you.

Personally I have seen with my own eyes some PS3 chips totally damaged with corrosion because users had relied on liquid metal & expensive carbon based pad solutions that were all touted as non corrosive & PS3/Xbox compatible.
A manufacturer's claims can be misleading or just untrustworthy.
 
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bguerville said:
Personally I have seen with my own eyes some PS3 chips totally damaged with corrosion because users had relied on liquid metal & expensive carbon based pad solutions that were all touted as non corrosive & PS3/Xbox compatible.
Click to expand...

Yes, I agree with this. I have decided not to use liquid metal mainly due to the corrosive effect it has on the surfaces.
(Even though LM is proven to be the best thermal conductor.)

As far as my thoughts about using thermal pads goes:
(I doubt Carbonaut pads will be corrosive.)
The main problem with the PS3 is that the thermal paste dries up, over some years.
Thermal pads don't dry up.
So, I'm willing to spend ~$80AUD to run the experiment on my own PS3 system and see the short-long term results that thermal pads will have. If it fails, no big deal, I will just switch to thermal paste.

The thermal pads should never need to be replaced. I like the idea of a set-it-and-forget-it PS3.

I think that's a good plan.
 
Dont get confused with the 65w/mk numbers of the carbonaut, the fact is the thermal grizzly kryonaut with 12.5w/mk beats it. In the practise the performance of the carbonaut is on pair with other thermal pastes
The reason for this is because the carbonaut is a solid material and it have pores, if we think in it at atomical level the contact in between the surfaces is reduced a lot
A thermal paste is going to enter a lot better in the tiny imperfections of the metal surface... and in the liquid metal this effect is achieved even better... the main reason why the liquid metal is so good is because is liquid :D

A big difference in between the carbonaut and the standard thermal pads made of silicone is the carbonaut only works fine under lot of pressure, and is not "gummy" like the silicone thermal pads
Thats the reason why i said i would never use it in other components like voltage regulators, because the surface of the voltage regulators is irregular, the carbonaut is a thin layer mostly solid so is not able to "fill the gaps" on top of a voltage regulator

The carbonaut is mostly focused to use it in devices that doesnt requires much manteinane, like a web server... or an old PC you use a lot, it never overheats but you dont care much about it, just needs to work, in that case yeah, a carbonaut allows you to dont worry about it anymore

That said... using the carbonaut in the CELL/RSX is fine, but dont expect a great performance, the good thing is the performance is not going to be reduced along time, but other than that... dunno, i think is not worthy

For the EEGS and SB of the COK-001 yeah... it fits very well because have a IHS and i guess doesnt overheats much.. as far i remember from factory have a thermal pad made of silicone... so the carbonaut should be a bit better... is just is too much expensive
Im not sure which height is needed in them btw, as far i remember there is a gap of 1.5mm and the carbonaut cant fill it

Some reviews:

In this one it can be seen how the kryonaut is the winner of all thermal pastes... with the permission of the conductonaut (but the conductonaut is a liquid metal, not a thermal paste)
https://www.guru3d.com/articles-pages/guru3d-thermal-paste-roundup-2019,12.html

Here they made another review, where they included an special edition of the "kryonaut extreme", and they reviewed the carbonaut too, of course the kryonaut extreme was better than the normal kryonaut
But note the position of the carbonaut... is at bottom of the table (around 5ºC worst than the kryonaut extreme)
https://www.guru3d.com/articles-pages/guru3d-thermal-paste-roundup-round2-2021,12.html

And here another review of the carbonaut versus stock thermal pastes
https://www.reddit.com/r/hardware/comments/bc3uck/thermal_grizzly_carbonaut_thermal_pad_review/
 
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Pacorretaco said:
The fan will always be annoying if you use high-level dynamic fan controls like you mention Irisman (probably Webman fan control).... These are ok but they just have too many limitations. Best to avoid if you can.

That's why I made guide about modifying the default SYSCON fan curves. Which is way superior system and it is low-level so it will always work great regardless of the firmware. Including ofw, PS2 mode, otherOS or even with no firmware at all in case of freeze or whatever.
Click to expand...
where i can find this guide of yours about modifying the default syscon fan curves ? it got my interest ;)
 
sandungas said:
That said... using the carbonaut in the CELL/RSX is fine, but dont expect a great performance, the good thing is the performance is not going to be reduced along time, but other than that... dunno, i think is not worthy
Click to expand...

I've been thinking about temps and fan speeds a lot over the last day or two.
I had a realization that with the PS3 temps are king; even if I have to replace the thermal paste in the future.
I have decided that I will use Kryonaut for the whole thing. Except maybe I will put a Carbonaut pad on the RSX heatsink as it seems it's the least important to keep cool.
 
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sandungas said:
the 65w/mk numbers of the carbonaut, the fact is the thermal grizzly kryonaut with 12.5w/mk beats it
Click to expand...
Exactly, here's a proof:

And, as I already did my homework, I've found what would be the best setup in terms of paste/pads/money for this console. Delid is mandatory as it reduces thermal risks a lot, and also it reduces the distance between die and IHS. According to this video, Gelid GP ultimate is the best one in the comparison (carbonaut isn't there but who cares). It also has half the price of the Grizzly Pad 8, same performance. Interesting fact from the video, If you apply better thermal pads in a big heatsink that also has a chip's die under, then the temperature of the disipation will tends to rise, making the die temp also rise, and therefore the need of inscreasing the fan rpms and also noise. Logic.


Now Gelid thermal paste equals Kryonaut:


So, the best combo it's gelid thermal paste for dies and gelid thermal pads for everything else. It sounds so nice that I'm gonna do it someday :D

P/S: Another person that leaves four leaf clovers when going to take a dump. Watch the delid process.

 
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