I have a bunch of A01, B01, and E01 units. They are all delidded, all running the same PSU, all running same fan. I have spent like $50 on different thermal compounds trying to find the best one, including liquid metal. No matter what combination I used, I have no difference after testing MX4, AS5, Antex Formula X, liquid metal, Chinese paste. Within each individual unit, they run the same temperature/fan speed in the same test loop. Some units will run TLOU title screen at 28%, some will run at 31%, I have one particularly bad unit that will run it at 34% (under 68C limit).
Is it time to stop chasing paste and start accepting the heatsink differences between units may be to blame, or binning on the chip may require different voltage to operate? I have one particular unit that never cracks 30% fan speed when playing TLOU which is crazy to me, while I have another that's always bouncing between 31 and 36%. I always apply thermal paste the same way: thin initial layer then another couple dots so that it spreads nicely when the clamps go on.
Is it time to stop chasing paste and start accepting the heatsink differences between units may be to blame, or binning on the chip may require different voltage to operate? I have one particular unit that never cracks 30% fan speed when playing TLOU which is crazy to me, while I have another that's always bouncing between 31 and 36%. I always apply thermal paste the same way: thin initial layer then another couple dots so that it spreads nicely when the clamps go on.