PS3 Fault finding YLOD with the SYSCON - First steps and Error reporting

Does anyone know where I can find the full startup sequence (A models)? When you run the "lasterrlog" command in CXRF mode it lists the powerup sequence information, but initiates the shutdown sequence when encounters an error. The step of the power up fail is listed in the error codes generated (00-7F). I would like to see the full power up procedure.
 
RIP-Felix said:
Does anyone know where I can find the full startup sequence (A models)? When you run the "lasterrlog" command in CXRF mode it lists the powerup sequence information, but initiates the shutdown sequence when encounters an error. The step of the power up fail is listed in the error codes generated (00-7F). I would like to see the full power up procedure.
Click to expand...
There's one on this thread somewhere, let me see if I can find it.
 
RIP-Felix said:
Does anyone know where I can find the full startup sequence (A models)? When you run the "lasterrlog" command in CXRF mode it lists the powerup sequence information, but initiates the shutdown sequence when encounters an error. The step of the power up fail is listed in the error codes generated (00-7F). I would like to see the full power up procedure.
Click to expand...
Found it! It was on page 3... I thought it was going to be further down than that.

LSL said:
From another PS3
Code: 
[SSM] state: 0000 -> 0101
Bringup Mode #0 (0xFF)
[SSM] ssmCb_OnStartingBePowOn() called.
[SSM] First Boot.
[SSM] Bringup mode : syspm_stat=00000000/00000000
[POWSEQ] PowerSeq_Setup called.
[SSM] state: 0101 -> 0201
[POWSEQ] AV Backend Setup
[SSM] state: 0201 -> 0102
[SSM] state: 0102 -> 0202
[SSM] state: 0202 -> 0103
[SSM] state: 0103 -> 0203
[SSM] ssmCb_BeforeBeOn() called.
[SSM] state: 0203 -> 0104
Psbd_SbTransMode_Half:0x20e2
[SSM] state: 0104 -> 0204
[SSM] state: 0204 -> 0105
[SSM] state: 0105 -> 0400
(PowerOn State)
[SERV NVS] READ CMD

Boot Loader SE Version 0.9.5 (Build ID: 1634,16289, Build Data: 2006-09-21_19:11:09)
Copyright(C) 2006 Sony Computer Entertainment Inc.All Rights Reserved.
[SERV SETCFG] XDR (CH0,CH1) ASSERT
[SERV SETCFG] XDR (CH0,CH1) DEASSERT
[INFO]: Connecting to Debug Device (SB UART)
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV NVS] READ CMD
[SERV THERM] NOTIFY_MODE CMD
POWER Button released
[SERV NVS] READ CMD
[SERV NVS] READ CMD

[mullion]$ [SERV NVS] READ CMD
Click to expand...
 
I am getting 0xa0022110 error on my DIA-001. Some that have gotten this error have changed PS6001 but I cannot find any component labeled PS6001 on my motherboard. Any help? What should I do?
 
hey, i am new and i buy a YLOD PS3 Phat DIA-001, can anyone give me a scheme,picture or diagram of motherboard to find RX,TX,GRN, because i can't find ! Thanks !!!
 
The F6001 fuse is blown on my DIA-001 board and I don't know its specs. Any recommendations for replacement?
 
More systems starting to stream in. Spreadsheet updated a little. Warranty sealed CECHA01 A0403034 had ripped trace under RSX. Fixed and stress testing now.

Pay extra for warranty seals, folks.
 
nyislander said:
How can a trace be "ripped" in a warranty sealed console?
Click to expand...

No idea, there was no evidence of a drop. Lift was clean, I'm almost 100% sure it wasn't me. Maybe it landed flat on carpet so it didn't dent any corners or anything? That would still give it a good jolt to the heatsink.
 
It could happen in desolder process First mobo should be seated on jig but not very well tied to jig. Just enough that you can not move it up/down. It will get bended at 230 so pressure of screw that keep board down is tied on level of mobo but not much pressure will leave pcb to extend itself. Once both desoldered board will become straight. If not It will on solder process. Here you can tie board strong enough. If I get bended board I don't tie screws to much on that side.
This is another advice/trick for reball process that I will post in my thread if I will be asked again.
Edit
Fixing broken pads is quite easy. Need some dental needles which are quite tiny, they can pass through pcb vias from top to bottom. Once hole is empty use some enamelled wires from headphones, usually I use 2 twisted. Now on ic I use lead free alloy to solder wire on needed point , rest of balls leaded. Pass wire, seat ic on pcb. When reball at 205, that wire will remain there because is soldered with stronger alloy.
When finished cool down, pull and see if wire will get out. For me works well.
 
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If using big preheater, which will cover all mobo size, there should happen no bend. Drafts should also be avoided.
I'm personally using cheap Chinese PUHUI T-8280, it covers the whole PS3 motherboard, heats up slowly. No bends occured.
 
Have you seen that corner is always getting pads of? Mostly because that place does not have equal pressure from radiator. Never understand why they fitted only 2 screws on ic. Have seen meny sealed phat boards bended. Because of cold/heat cycle when they are old that pads could go off.
I know you are confident on what you do, but sometimes it can happen. Always that corner. Sometimes other corners from people pushing pressure to fix ylod which I don't ever recommend.
Didn't pay attention what model is that you work, but I assume phat. Well on slims I bearly seen broken pads on sealed units.
Edit
Most people should be careful even when disassemble mobo from radiator to exchange thermal paste as when they pull it up and use force to separate mobo, they lose contact under ic for sure. This days I seen many people doing this .
 
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Byteman said:
If using big preheater, which will cover all mobo size, there should happen no bend. Drafts should also be avoided.
I'm personally using cheap Chinese PUHUI T-8280, it covers the whole PS3 motherboard, heats up slowly. No bends occured.
Click to expand...
Yes, avoid constrained thermal expansion in all directions but support the mobo in a flat plane!
 
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