RIP-Felix
Senior Member
Should be fine.@RIP-Felix do the tantulun on msx-001qualify for ps3 fat dia-002 65mm cell and rsx.I think I got like 16 or 12 of them on board.
Should be fine.@RIP-Felix do the tantulun on msx-001qualify for ps3 fat dia-002 65mm cell and rsx.I think I got like 16 or 12 of them on board.
ok so how do I apply them I was reading @Naked_Snake1995 post and he mention that processors side one are usually ok and bottom ones should be tested first but mine gives a 1002 error 3003 and 3004 indicating rsx caps on both side and cell on one side. Should I first try piggyback the tantalums on nec first if yes then how can you give a diagramShould be fine.
Just found out after harboring my fat cech k04 dia-002 for 1.5 years it houses a tmp411 A and tmp411 B and @RIP-Felix does RSX 65mm CXD2982GB fall in bumpgate timeline.Well if that's a concern I do not know about fats but from cech 2500x to cech 4300x have Sherwood 2 or 3 syscon and use same tmp411 a and b. But question is if I swap a tmp411 a from a cech 3000x kte-001 motherboard with my pqx-001 tmp411a. Would it be successful transplant or not . I am questioning compadibility.what do you say @sandungas @RIP-Felix .
3004 is just a more serious version of 1002. it's the same story with 1001/3003. It doesn't tell you anything about which side of the MB the tokens have failed.ok so how do I apply them I was reading @Naked_Snake1995 post and he mention that processors side one are usually ok and bottom ones should be tested first but mine gives a 1002 error 3003 and 3004 indicating rsx caps on both side and cell on one side. Should I first try piggyback the tantalums on nec first if yes then how can you give a diagram
alright i 'll try to piggyback first when I declear the msx-001 as scraped if I don't fix the 3010 1701 and 14ff error within the next month got any clues where to poke.3004 is just a more serious version of 1002. it's the same story with 1001/3003. It doesn't tell you anything about which side of the MB the tokens have failed.
Side B is easier to access and remove.
Yes, but it doesn't have the "same" underfill. If it's suseptable to premature failure, it's not by the same mechanism as the 90nm.@RIP-Felix does RSX 65mm CXD2982GB fall in bumpgate timeline.
ok so that's a bit of reliefYes, but it doesn't have the "same" underfill. If it's suseptable to premature failure, it's not by the same mechanism as the 90nm.
Sent my ps3 to transfer 40nm from slim to cecha. Technician delided 40nm, could this be a damaged ram?
Before bittraining fix
BitTraining RSX:RRAC:BX0:BX:FLEXIO_ID
After bittraining fix
BitTraining BE:RRAC:RX1:GLOBAL1:RX_STATUS
0xa0403034
What trace is responsible for this error, i don't know methodology how to trace it, some of the previous post managed to find it, but wasn't clear to me.
Possible solution: reball or reflow?
For R2135, instead of scratching ground pad, i made a shunt to ground pad near bluray wide ribbon connector.
I did find it! The bit training traces are all on both sides of the space between cell and rsx (and there are some between cell and southbridge). They're really simple, straight short traces. Your issue is less likely to be the trace, and more likely going to be solder joint. Reflow or reball depends on what you want— some people just want a reflow that works long enough to get saves out, and some people want a long term fix, but reballs are expensive. There's been a great many flame wars over the subject….
I don't think there's a tutorial, just discussions between Felix and I. The RX0, RX1, etc, are sequential (and there's 4 lanes, so 0-3), so it shouldn't be hard to figure out which trace leads to which pad. If you already found my screenshot, that's a great starting point.Reflow is tempting, because of reheating cycles rudeced compared to reball, but with reball could inspect if there are any lifted pads.
Is there a tutorial to lear to trace error like: BE:RRAC:RX1:GLOBAL1:RX_STATUS to a physical trace?
Also, could you can tell which BGA point is responsible for this error, so a technician would inspect it.
I have seen your image in previous post. with highlighted traces for RX0 if i remember correctly.
Thanks!
For R2135, instead of scratching ground pad, i made a shunt to ground pad near bluray wide ribbon connector.
Can you explain? This should be 10k to GND. And a long wire could cause issues.
0xb0002001 (FATAL) XDR Link not initilized.
I'm getting the same error on a console at the moment. I shelved it until a thermal camera arrives, because I'm operating under the assumption that an XDR memory module has failed. When booting it should be the only one that doesn't heat up. I'll first try replacing that, but if that doesn't work it could be the CPU's BGA pads from the XDR.
ACE Console repairs had this happen to him recently. In his case it looked like drop damage, because the CPU pads were completly torn.
I have repaired a CECHH model with a0a02031 errors. And replacing thermal sensor IC does fix the console.Hey guys. Looking for some quick pointers on a CECHA with the infamous YLOD.
Im in Europe so these are pretty rare as we only got the CECHC models. Anyways syscon is currently showing 2 different codes.
A0093003 and most predominantly A0A02031.
NEC/TOKEN have been replaced as the A0093003 was the most frequent error and now it appears to be 2031. Is it worth replacing the temperature sensor or is it likely a dead RSX chip?
I'm typing on mobile so not sure how to attach the log.
Thanks guys.
Hi [mention]RIP-Felix [/mention]
Did you get your thermal camera?
Have you tested those Shelved consoles with the XDR Link errors?
See my previous post: https://www.psx-place.com/threads/f...nd-error-reporting.30100/page-163#post-353795Hi, can anyone help (new with some error codes of syscon)
I got a PS3 fat Cechh01 (Dia-001), I made syscon read today, I got 2030-2031-2033 (thermal SB, RSX and Cell BE), what does that mean, what I need to check or replace.
And a another thing is my PS3 when I plug in after some seconds automatic power on but I can't turn it on by pushing the sensors, help