RIP-Felix
Senior Member
I'm trying to get an idea of whether or not the 90nm RSX in A-E BC models and G/H models are reliable. We know they can have BGA defects. We've seen oxidized balls while reballing them!
What's less clear is how many of these consoles met their fate from BumpGate! In 2006-2008 Nvidia made poor bump and underfill material choices in some (if not all) of their chipsets designs. The got famously sued over this. RSX was designed and made during the BumpGate time frame, but there isn't any reliable data on how many 90nm RSX's have actually died from genuine bump failures.
While there are many theories about how one might be able to tell the difference between Bump and BGA failures, there really ins't a good way to know without 3D x-ray machines that cost $1,000,000. Clearly that option is off the table!
Instead I'm asking you, the community, to give us your experience with reballing. If you had a 90nm RSX reballed did the reball last or did the console subsequently die? And if so, how long after the reball did it last? If it's still going, how long ago was it reballed?
Obviously this poll won't exclude other failures, like NEC/TOKINs, fuses, CPU, etc. But this is the best we can do without diving into each and every console to diagnose it on a case by case basis. However, please feel free to reply with any additional details about your specific experience. Did you replace the tokins afterwards and it's been going strong ever since? Did you have it reballed again? How long did it last that time?
Maybe we'll get a better sense of whether or not the Bumps do fail, if reballs didn't last. Or maybe we'll see that the bumps were fine and reballs did last. Either way it'd be interesting to see some real numbers.
What's less clear is how many of these consoles met their fate from BumpGate! In 2006-2008 Nvidia made poor bump and underfill material choices in some (if not all) of their chipsets designs. The got famously sued over this. RSX was designed and made during the BumpGate time frame, but there isn't any reliable data on how many 90nm RSX's have actually died from genuine bump failures.
While there are many theories about how one might be able to tell the difference between Bump and BGA failures, there really ins't a good way to know without 3D x-ray machines that cost $1,000,000. Clearly that option is off the table!
Instead I'm asking you, the community, to give us your experience with reballing. If you had a 90nm RSX reballed did the reball last or did the console subsequently die? And if so, how long after the reball did it last? If it's still going, how long ago was it reballed?
Obviously this poll won't exclude other failures, like NEC/TOKINs, fuses, CPU, etc. But this is the best we can do without diving into each and every console to diagnose it on a case by case basis. However, please feel free to reply with any additional details about your specific experience. Did you replace the tokins afterwards and it's been going strong ever since? Did you have it reballed again? How long did it last that time?
Maybe we'll get a better sense of whether or not the Bumps do fail, if reballs didn't last. Or maybe we'll see that the bumps were fine and reballs did last. Either way it'd be interesting to see some real numbers.
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