PS3 Using a Digital XRAY to inspect boards

In other words the heat generated to remove the old RSX and then reball the new RSX could actually be flexing the board to reconnect BGA defects on the CPU. I have discovered that using thermal pads to create pressure behind the CPU boots the console, and not only that, it lasts as all 10 I have performed the mod on are still working.
You have some evidence and i have a GLOD and i could try but before damaging the motherboard i want to access the southbridge with syscon. However you say that the heat used to melt the RSX solves the problem with the CELL. But how high would the temperature be on the cell while working on the RSX? and then once cooled, shouldn't the motherboard return to its normal position? I don't think the heat on the RSX can revive the cell, at most something close to it, something that is between the RSX and the CELL.
 
I have subsequently discovered that the pressure on the CELL is actually pushing the board in such a way that it's reconnecting an RSX BGA issue. So it's nothing to do with the CELL.

Sent from my SM-F936B using Tapatalk
 
I have subsequently discovered that the pressure on the CELL is actually pushing the board in such a way that it's reconnecting an RSX BGA issue. So it's nothing to do with the CELL.

Sent from my SM-F936B using Tapatalk
So why not press directly behind the RSX? To say this, you need to be sure that the RSX bga is faulty.
 
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