sandungas
Developer
The other day i was talking about this with @ElGris and i forgot to mention the copper pipes, but yeah... the pipes are "glued" to the other metal parts, and that glue is critical, sometimes it could "crack" so the pipe is unglued... there is also room for improvement in how is applyed because lot of times the glue is not filling the gaps completlyPerhaps the other 2 Tokins are bad. I can try replacing them with tantalizers and see if that helps. But first I want to try another HS to see if perhaps this one's heatpipes have crapped out or something. Still a mystery why this cell is so hot. It could be the cell, so if another HS doesn't change anything I'll know the cell is causing it. Then I'll try the remaining tokins to see if they are doing it. If not, I'll just have to accept this one runs hotter.
Not sure what to make of that yet.
Another problem of the PS3 heatsinks is sometimes the interference shields are "pushing" it either outside (so the pressure is reduced in a non-uniform way), or are pushing it laterally causing a small rotation.. in both cases the result is the heatsink surface is not completly paralell to the IHS surface
So yeah... if you have some replacement heatsink at hand try to replace it
And btw... if you are going into this details, the first thing i would do is a lapping of the IHS, sometimes the surface have a bending from factory, the lapping is going to solve it and is easy to do
In PC i use to apply a layer of thermal paste the most thin as posible because i know the surfaces are very flat and there is nothing that could affect how the two surfaces stays paralell to eah other, but in the PS3 is better to apply a little excess to fill the gaps caused by the problems i mentioned above, i do it tooYeah if you're a average person is not recommended, what gain do you get overall by just putting thermal paste over the ihs? down 2 degrees or soo?
although most people make the mistake of putting too little thermal paste on the RSX and CPU that has to cover the chips, not just the core
I say this from experience, before I had 60 60 adding "enough" and now I have 51 57 just because I put more thermal paste than before
But it needs to be made with a "non-electrical conductive" thermal paste because a bit of the excess of thermal paste is going to be "squeezed" outside... we need to count with it









