Hi,
Yes, the temps are low; that's because the pressure does two things. The first thing it does is push the CPU die towards the underside of the heat spreader. This heat spreader is not straight, which is why the die loses contact with the heat spreader over time. By pushing down on the motherboard directly under the CPU reconnects, the CPU die with the heat spreader (which has all the paste) and this immediately gives you better temps. See the link below on de-lidding
The second thing it does is reconnect broken CPU solder balls. This is one of the main causes of the GLOD. I have also discovered that it's advisable to add a few tantalum capacitors to the top side tokens, one on the CPU side and one on the GPU (see pics). I also add thermal pads to the tokins. If you watch all the videos, all your questions will be answered.
Sent from my SM-G988B using Tapatalk