PS3 slim fan speed

That memory chips on RSX corners doesnt goes much hotter btw, look at the superslims, doesnt have IHS on the RSX
And i remember to be looking at the datasheets of some of that chips and they can hold a lot of heat

And is not needed to glue the IHS (with any kind of glue neither with thermal glue)
Is better to drop a bit of silicone in between memory chips (the same kind of silicone used on CELL)

And last bonus btw... in PC there is people that removes the IHS completly
By removing the IHS you are removing an obstacle... keep in mind the heat needs to make a "jump" everytime the material changes... so you are removing one "jump" and the cooling is better without IHS

In PS3 can be made the same (like in PS3 superslims without IHS in the RSX), the problem is after removing it the heigth changes... so maybe the heatsink surface doesnt touches well
 
Edit:
The dailly drawing, this is the RSX, the blue dots are like "columns" made with silicone
QKEG5Kg.jpg

Im not sure how is named in english, but i mean this kind of silicone (not exactly)
trucos-limpiar-silicona.jpg

There are silicones like this that are thermal resistant, are used in car garages, basically there are 2 types:
-grey (for closing and sealing engines)
-orange (to isolate the internals from noises)

And you can buy them in small tubes (instead of huge tubes like in the photo i posted)
 
sandungas said:
That memory chips on RSX corners doesnt goes much hotter btw, look at the superslims, doesnt have IHS on the RSX
And i remember to be looking at the datasheets of some of that chips and they can hold a lot of heat

And is not needed to glue the IHS (with any kind of glue neither with thermal glue)
Is better to drop a bit of silicone in between memory chips (the same kind of silicone used on CELL)

And last bonus btw... in PC there is people that removes the IHS completly
By removing the IHS you are removing an obstacle... keep in mind the heat needs to make a "jump" everytime the material changes... so you are removing one "jump" and the cooling is better without IHS

In PS3 can be made the same (like in PS3 superslims without IHS in the RSX), the problem is after removing it the heigth changes... so maybe the heatsink surface doesnt touches well
Click to expand...
PS3 Super Slims have only a heat pipe on the RSX, i also though the same about the phat, but here mainly the RSX its the problem, this issue with the IHS can only be resolved with a custom cooling of sorts :)
 
After removing the RSX ive tested it with a PS2 Game (60º CELL/55/57º RSX) and with Gran Turismo 5 Stress Test - 66º CELL and 61/65º RSX with 32% fan, previously 37%. Anything below 70º is fine by me, but below 65º on both is excelente.

I wont bother deliding the CELL as it can handle much more thermal stress, as it was designed mainly for PC/Server applications where thermal temperatures are above 70º, but keeping both below 70º for a 60Gb imo i think is optimal.
 
dmr said:
Aha, and can you test some game with syscon control? What fan speed and temperatures u get?
Click to expand...
Not to be rude, but i am not going too do it hahahahahhaahha, but ill tell you this, 70º on both and upwards, following by YLOD. ;)

Majority of people who own a 60Gb never leave the fan on Syscon (27%), the 1st thing they do its get CFW and webman, and crank the fan on upwards 30%,or you can kiss the 60Gb goodbye :D
 
dmr said:
Aha, so I just wonder if the PS3 fat syscon have different fan speed, but I guess not :)
Click to expand...
You know what its the problem with Sony´s syscon fan on a 60Gb!? They prioritise noise over cooling, on a 45nm Slim Syscon is fine, but get this the 60Gb its running 90nm on both chips, and drawing an abismal 220W in game, while the 2500 Series and above only use 110W or 90W i belive (if i am not mistaken), and both chips use less Amps, the rest i dont need to explain :)

If you leave the 60Gb on stock Syscon fan, the best it will go its to Level2 Fan, and running the machine to 78/80º on both, only when reaches 90º the fail safe will trigger, untill then the console will appear to be running fine when its actually cooking itself to death.

Colectors say that if you mod a 60Gb they depreciate in value, but i totally dissagree on that, its the only way to preserve the console, even if its 100% clean its still not enough to keep it running long term, thats why the 60Gb die, and become rarer with each day, and more expensive amongs collectors due to PlayStation2 Backwards Compatibility.

Ill just leave this here too see for yourself ;)


Note that its a Debug Test unit DECHA00A (90nm same board revision as the 60Gb)
 
Me again and fan speed :D I bought another PS3 slim, this time 2103b. motherboard in this model is SUR-001. I left syscon to control fan again, and it is different than on 2504a or 2504b. Fan goes to 28% after 65C but stay on 28% even if temps are 72/72 CPU/GPU. I didn't wait anymore for temp to rise. Is this normal for this model?

I see there is no data for this model!? https://www.psdevwiki.com/ps3/Thermal#Fan_settings_per_PS3_model_based_on_syscon_data_reads
 
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dmr said:
Fan goes to 28% after 65C
Click to expand...
Fixed :P

I guess you was in a point where the speed was about to change to the next step
Note in CECH-25xx the speed of "step 9" is triggered at around 70ºC/69ºC

But that meassurements are not exact, there could be a small error because we are taking note at that values manually
In other words... the next speed could be triggered at 71ºC/71ºC ...or at 72ºC/72ºC
 
Aha, maybe I was at the edge :) I hear change in sound, so probably fan speed getting higher :) I will try again :)
 
Based in the values you mentioned, i think CECH-21xx is doing the same than CECH-25xx

Look at the difference of temperatures in between steps 2,3,4,5,6,7,8 .... is only 1ºC degree of difference
This means the speed changes for every degree up to "step 8"
But the difference of temperatures in between step 8 and 9 is way bigger... for CECH-25xx is 5ºC degrees
This means the PS3 is going to use the speed of "step 8" for a longer time than the other previous speeds

In some way, this means the engineers considered that temperature and speed of "step 8" is the usual "working temperature"
The speeds and temperatures before step 8 are considered unestables because the PS3 is still warming up
And when you reach "step 8" the PS3 should stay in it

All this considering the PS3 is in good manteinance state, with good thermal paste, the heatsink firmly attached etc..

If the PS3 have some problem then is when is going to trigger other steps in the danger zone... 9, 10, 11, bang !
 
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Will try later with some game and I will wrote all changes in speed and on what temps, so you can put in chart :)

EDIT: Tell me is there any major difference between 2103b and 2504b?
 
They did that to reduce the noise level ;)
The point is the PS3 should stay in "step 8" (or "step 9" as much) while you are playing a game

If the PS3 stays on "step 8" at all time while ingame, then the noise level is the same... and our brain "filters" it, after some time we dont notice it

Another thing the syscon does to reduce noise level is it uses a timer delay when stepping back
As example, if you are on "step 9" and the temperature is reduced a lot (because you quitted the game) then the speed doesnt changes inmediatly... it waits some minutes (just incase the temperature increases again and takes you back to the "step 9" you was)
 
Hmmm, I just played uncharted 2 again for half hour. Fan goes to 29% at 73/73 and to 31% at 74/75C (or 74/74), and stays at 31% and temps slowly drops. This is hotter than 2504 which boost fan at 31% at 73/73.
 
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