PS3 Syscon fan settings (Coordinate Graphs)

woohoo, I have bought that decr1400 now and maybe fullfilled my strongest wish since dex release. hopefully all goes well and this ps3 is as great as described in the description
 
sandungas said:
When you mention "the thermal solution" you mean all the parts related with thermal ?... in other words, the block of heatsink + fan + interference shields together ?
You are makig me doubt if the heatsink and fan from DEB-001 are different than retail, i cant find any photo of them, i always assumed was identical to retail
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Yes, I also assume they're the same as retail (the wiki says it's type 1).

My guess is the DECR-1400 (with DEB-001 motherboard) is going to have the same thermal profile than VER-001 because this thermal profiles depends only of a few components and parts... and from them the most important are CELL and RSX
When they decided to use the CELL/RSX from VER-001 in DEB-001 probably the thermal profile was taken too
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Yes, the DIA-002, VER-001, DEB-001 and DYN-001 have the same CELL/RSX.
The main difference between the cooling would be that the DIA-002 uses type 3?, VER-001 type 4, DEB-001 type 1 and the DYN-001 type 5.
It's obvious that type 1 should be better than type 3 and 4 and these are also better than type 5.

I just thought this was interesting, Sony could have used the type 1 cooling solutions all along but consumers only get the cheaper solutions.
 
M4j0r said:
Yes, I also assume they're the same as retail (the wiki says it's type 1).
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Where is mentioned that ?, and how is mentioned literally ?
DECR-1400 with a type 1 heatsink... or DEB-001 with a type 1 heatsink ?
Im wonedring if it could be an error, there is a big timegap in between the manufacturing dates
In that case maybe you are right when you said the thermal profile could be configured for an "industrial" usage using hgher duty values or even more customized

M4j0r said:
Yes, the DIA-002, VER-001, DEB-001 and DYN-001 have the same CELL/RSX.
The main difference between the cooling would be that the DIA-002 uses type 3?, VER-001 type 4, DEB-001 type 1 and the DYN-001 type 5.
It's obvious that type 1 should be better than type 3 and 4 and these are also better than type 5.

I just thought this was interesting, Sony could have used the type 1 cooling solutions all along but consumers only get the cheaper solutions.
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As far i did read lot of time ago (not sure if is real) the import/export taxes for the heatsinks depends a lot of the lenght and amount of copper pipes
It seems to be because that copper pipes contains some toxic stuff inside them, is a bit the same that happens with the "lead free" devices, by removing or reducing the size of the copper pipes they was reducing the taxes


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Btw for everyone to know... the glue used in the copper pipes of some PS3 heatsinks is bad quality, it becomes fragile and sometimes it cracks and falls appart, there are also some "gaps" in between the copper pipe and the metal that are clearly a mistake in the way the glue was applyed

Dont think that your heatsink is good quality just because how it looks the metal... the glue plays an important rol in the performance
And the copper pipes too... never bend them... if you bend it you are damaging it permanently

In my oppinion the best way to do some mainteinance to that heatsinks with problems in the glue would be to try to remove the most posible amount of glue (but remember to DONT DAMAGE THE COPPER PIPES)... and then use a good thermal glue all around the pipes
That glue needs to touch the copper pipe and the metal obviouslly... his rol is to play as a "heat transference" material in between the copper pipe and the metal

Im mentioning this as a curiosity sake, i never made it, also the amount of thermal glue required to do this makes the process something expensive, but in this forum there are some "hardcore" modders that could be interested to do this to his fatties :D
I think this could be a nice experiment... mostly because is made in a part that is not really critical... i mean... if the experiment goes wrong and the modifyed heatsink doesnt have a better cooling performance... just buy/use a different heatsink
 
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@M4j0r
I know it is some stupid idea, but do you know if it would be possible to replace ram chips and increase size? just for my personal interest. Joonie has said sth like this and I should ask you about
 
haxxxen said:
@M4j0r
I know it is some stupid idea, but do you know if it would be possible to replace ram chips and increase size? just for my personal interest. Joonie has said sth like this and I should ask you about
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Me not know nothing but i remember to talk about this with other people and the consensus was that to achieve something like this it would be needed (at least) to modify the hypervisor
It seems the hypervisor creates some kind of "virtual map" of all the devices contiguous and every device is given a range in a address, so i guess it would be needed to reconfigure that map to assign more room to the ram

And just another brainstorming... it could happen that the memory is configured in the bootloader, in that case is a road end because we cant modify the bootloader :/
Not sure, but this mod to double the ram capacity is interesting
 
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I see, there still could be some kind of software limitation. the only limitation I know of, is you can limit gameos ram on decr with debug option. it even kinda works on dex using decr vsh, tbough it freezes cause lack of ram of course.

btw, back then when I've got crazy with this idea, I started to desolder ram chips on a cechl, slim and superslim and realized the difference with the solder balls. upto slim sony used 104ball rams and more balls (dunno the number atm) on slim and later. also upto slim it is some kind of quad channel and only dual on slim. though the quads are 16bit and the duals are 32bit (should be almost equally). I was kinda serious with this honestly
 
@sandungas and @M4j0r
thanks both of you, cause now I think I get what you are trying to tell me. it should be similar to a pc, where you also have to program the bios, to reflect newer chips with maybe higher capacity. afterall, the chips I have found from this seller, are all "younger" than the ones already on the ps3

tbh, I really would like to try this, but there is a difference to just desolder these chips and then resolder them, where I do not have the right equipment to do so. since I've got some money lately, maybe I will order these chips, but then I have to find an expert to solder them back for me. besides, a test on a slim should be easier, since there are only 2 of them

oh, I also have to appologize again, for posting and asking in this thread
and some side note, thanks for being part of this great community on here and also that there were/are so many great minds working on ps3
 
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Dont worry, the ram chips probably are in the list of the "top five hottest components of the motherboard"... so is a bit ontopic :)
I forgot to mention them in the list i made in a previous post with the components and parts that could make the engineers to modify the thermal config area inside syscon... but i guess is needed to consider them too

Btw, for curiosity sake... if you take a look inside the heatsink of the PS3 slims (after removing the fan from it) you are goping to see there are a few little holes in the center. When the fan spins is creating some kind of "vortex" at his center that is "sucking" air from that holes, and that holes are located exactly on top of the ram chips
In few words... it looks the engineers added that holes to cooldown the ram chips, so better dont mess around with that holes, are good and we should not modify them

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Yep, the most intuitive way to think in the ram initialization is comparing it with the BIOS of a PC... and the "virtual map" i mentioned should be something like that menu in the BIOS where can be seen the adressess of the PCI devices... is just the hypervisor is doing some additional weird thing with it

The doubts we have now is if the retail software (bootloader, hypervisor, etc..) is ready to identify different ram chips than the ones that it had original from factory
Considering we are going to replace them by other ram chips that belongs to the same manufacturer, and even the same "series"... well... maybe works because are not so different
Incase it doesnt works, this mod could be very tricky to acomplish, i dont know much people experienced in that lower stages of the PS3 bootchain
 
sandungas said:
The doubts we have now is if the retail software (bootloader, hypervisor, etc..) is ready to identify different ram chips than the ones that it had original from factory
Considering we are going to replace them by other ram chips that belongs to the same manufacturer, and even the same "series"... well... maybe works because are not so different
Incase it doesnt works, this mod could be very tricky to acomplish, i dont know much people experienced in that lower stages of the PS3 bootchain
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The XDR RAM link needs specific training data, like the RSX for the FlexIO interface.
The XDR RAM link training is done by syscon and lv0ldr, RSX FlexIO training is done by syscon and lv1.
So if newer XDR chips really need new training data, then you to have exchange the Cell, but this isn't possible since they're not compatible with older board revisions.
 
M4j0r said:
The XDR RAM link needs specific training data, like the RSX for the FlexIO interface.
The XDR RAM link training is done by syscon and lv0ldr, RSX FlexIO training is done by syscon and lv1.
So if newer XDR chips really need new training data, then you to have exchange the Cell, but this isn't possible since they're not compatible with older board revisions.
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ok, this sounds way too technical and complicated for me to finally give up the thought :(
 
haxxxen said:
ok, this sounds way too technical and complicated for me to finally give up the thought :(
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Dont throw the towell, it was a conditional sentence starting with an "if" :D
There is no proof if that "training" procedure is able to recognize bigger ram chips (of the same manufacturer, series, etc... i guess they needs to be the most closer posibles to the originals)
M4j0r said:
So if newer XDR chips really need new training data, then you to have exchange the Cell, but this isn't possible since they're not compatible with older board revisions.
Click to expand...
Btw, you really meant cell in that sentence ...or syscon ?
 
M4j0r said:
I mean Cell, since the XDR training data is part of lv0ldr and we can't change that.
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you mean it is not possible to directly patch lv0ldr?

I am not the kind of guy, that gives up too early (at least not on pc vs real life :( ), but this sounds not really worth the try and besides, I've realized, even cechl models differ with their ram chips. the one I have desoldered, had samsung, but now my broken other cechl has elpida. the one I am using atm, I dunno the brand

btw, I even now have the oportunity to buy a decr1000a, but I am still not sure if I should take it and also I don't know the price yet
 
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haxxxen said:
you mean it is not possible to directly patch lv0ldr?
Click to expand...

Yes, it's not possible until the per console key generation is known.
But maybe neither syscon nor lv0ldr need to be patched, but since this was never tested, we don't know.
 
haxxxen said:
you mean it is not possible to directly patch lv0ldr?

I am not the kind of guy, that gives up too early (at least not on pc vs real life :( ), but this sounds not really worth the try and besides, I've realized, even cechl models differ with their ram chips. the one I have desoldered, had samsung, but now my broken other cechl has elpida. the one I am using atm, I dunno the brand

btw, I even now have the oportunity to buy a decr1000a, but I am still not sure if I should take it and also I don't know the price yet
Click to expand...
Btw, when i said to dont throw the towell i meant the kind of desire where we could say "i hope some day it will be posible to achieve this"
In my oppinion that hope is legit, because there are some chances for it to happen (we are not sure yet)... is just you (and me) are not going to be who completes this research/experiments, because is needed a bunch of scrap motherboards to rip the ram chips from some them, solder them in other motherboard, and in the process most probably some motherboards are going to be damaged
I dont expect you to start messing around with your new DECR-1400, thats an special unit, take care of it ;)

Btw, i agree with what you said about the DECR-1000, i like a lot how it looks (a bit industrial, and even a tribute to the PS2)... the only bad thing from it visually is his size... if we could take one of that "reduction pistols" from the sci-fi films it could be nice to reduce his size in 30% or so, a "miniaturized" DECR-1000 could be cute :D
 
btw, SHE has finally arrived yesterday, but still haven't unboxed. at weekend I'll get my inet back and then I hope I can post some nice pix. I am a bit sceptical about it...and still thinking about the 1000a
 
Thread Update

Added coordinate graphs for:
VER-001 motherboard (PS3 models CECHL, CECHM, CECHP, CECHQ). This is the last PS3 FAT motherboard
DYN-001 motherboard (PS3 models CECH-20xx). This is the first PS3 SLIM motherboard

Other changes
All the previous images has been updated with minor visual adjustments (the data is the same than previous versions)
All the positions and sizes of the texts in all the images matches with each others (handy to compare them in a imageviewer in a slideshow)
Added CRC32
Reordered the "unknown" datas at bottom in a more intuitive way
 
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